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 TPD2005F
TOSHIBA Intelligent Power Device Silicon Monolithic Power MOS Integrated Circuit
TPD2005F
Low-Side Power Switch Array (8 Channels) for Motors, Solenoids, and Lamp Drivers
The TPD2005F is an 8-channel high-side switch array for vertical power MOS FET output. A monolithic power IC, it can directly drive a power load from a CMOS or TTL logic circuit (such as an MPU). It offers overcurrent and overtemperature protection functions.
Features
A high-side switch array incorporating an N-channel power MOS FET (1.2 max.) and an 8-channel charge pump Can directly drive a power load from a microprocessor. Built-in protection against thermal shutdown protection and overcurrent protection 8-channel access enables space-saving design High operating voltage Low on resistance Low operating current : 40 V : 1.2 max. (@VDD = 12 V, IO = 0.5 A (per channel)) : 5 mA max. (@VDD = 40 V, VIN = 0 V) Weight: 0.29g (typ.)
Supports parallel operation. Supplied in an SSOP-24 package (300 mil) in embossed taping.
Pin Assignment
(top view) VDD 1 GND 2 IN1 3 IN2 4 IN3 5 IN4 6 IN5 7 IN6 8 IN7 9 IN8 10 GND 11 VDD 12 24 N.C. 23 N.C. 22 OUT1 21 OUT2 20 OUT3 19 OUT4 18 OUT5 17 OUT6 16 OUT7 15 OUT8 14 N.C. 13 N.C.
Marking
Lot No. A dot indicates lead (Pb)-free package or lead (Pb)-free finish.
TPD2005F
Part No. (or abbreviation code)
Note: Due to its MOS structure, this product is sensitive to static electricity.
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Block Diagram
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Pin Description
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Symbol VDD GND IN1 IN2 IN3 IN4 IN5 IN6 IN7 IN8 GND VDD N.C. N.C. OUT8 OUT7 OUT6 OUT5 OUT4 OUT3 OUT2 OUT1 N.C. N.C. Output pin for channel 8 Output pin for channel 7 Output pin for channel 6 Output pin for channel 5 Output pin for channel 4 Output pin for channel 3 Output pin for channel 2 Output pin for channel 1 Description Power supply pin; in common with the pin No.12 internally. GND pin; in common with the pin No.11 internally. Control input pin for channel 1 and built-in pull-down resistor (100 k typ.) Control input pin for channel 2 and built-in pull-down resistor (100 k typ.) Control input pin for channel 3 and built-in pull-down resistor (100 k typ.) Control input pin for channel 4 and built-in pull-down resistor (100 k typ.) Control input pin for channel 5 and built-in pull-down resistor (100 k typ.) Control input pin for channel 6 and built-in pull-down resistor (100 k typ.) Control input pin for channel 7 and built-in pull-down resistor (100 k typ.) Control input pin for channel 8 and built-in pull-down resistor (100 k typ.) GND pin; in common with the pin No.2 internally. Power supply pin; in common with the pin No.1 internally.
Timing Chart
Note:
The overheating detector circuits feature hysteresis. After overheating is detected, normal operation is restored only when the junction temperature falls by the hysteresis amount (10C typ.) in relation to the overheating detection temperature.
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Truth Table
Input Signal L H L H L H Output Signal L H L Internally limited L L State Normal
Overcurrent
Overtemperature
Absolute Maximum Ratings (Ta = 25C)
Characteristic Supply voltage Input voltage Drain-source voltage Output current Power dissipation (operating all channels, ta = 25C) Single pulse avalanche energy Operating temperature Junction temperature Storage temperature Symbol VDD VIN VDS IO PT EAS Topr Tj Tstg Rating 45 - 0.5 ~ 7 60 Internally limited 0.8 1.2 (Note) 10 - 40 ~ 85 150 - 55 ~ 150 Unit V V V A W mJ C C C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Thermal Characteristics
Characteristic Thermal resistance junction to ambient (Operating all channels, Ta = 25C) Symbol Rth (j-a) Rating 156.3 104.2 (Note) Unit C / W
Note:
60 mm x 60 mm x 1.6 mm when a device is mounted on a glass epoxy PCB (DC).
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Electrical Characteristics
(Unless otherwise specified, VDD = 8 ~ 40V, Tj = 25C)
Characteristic Operating supply voltage Supply current Input voltage "L" level "H" level Symbol VDD IDD VIL VIH IIL IIH RDS (ON) IOL IS TSD TSD tON tOFF Test Circuit 1 VDD = 24 V, VIN = 0 V VDD = 24 V, VIN = 5V VDD = 12 V, IO = 0.5 A VDD = 40 V, VIN = 0 V VDD = 12 V, RL = 24 Test Condition VDD = 40 V, VIN = 0 V Min 8 3.5 -10 1 Typ. 50 0.9 160 10 11 4 Max 40 5 1.5 10 200 1.2 100 3 200 50 Unit V mA V
Input current On resistance Output leakage current Overcurrent protection Thermal shutdown
A A A C
Switching time
s
Description of Protector Circuit
(1) Overtemperature Protection There are four built-in overheating detector circuits, one each for channels 1 and 2; channels 3 and 4; channels 5 and 6; and channels 7 and 8, respectively. The circuit logic is such that, when any of the four detectors detects overheating, the circuit turns off the output of both its channels(for example, both channels 1 and 2). The overheating detector circuits feature hysteresis. After overheating is detected, normal operation is restored only when the junction temperature falls by the hysteresis amount (10C typ.) in relation to the overheating detection temperature. (2) Overcurrent Protection When overcurrent is detected, the overcurrent limiter function limits the output current. Normal operation is restored when the load current drops below the overcurrent detection value.
Test Circuit
Switching Time
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TRANSIENT THERMAL RESITANCE rth (/W)
60mmx60mmx1.6mm when a device is mounted on glass epoxy PCB. (operating all channels) Measuring single pulse
PULSE WIDTH tw
(s)
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Caution on Usage
1. As protection against reverse connection of batteries is not provided, take protective measures using external circuits. 2. As a negative bias protector circuit is not built into the output pins, if negative bias is applied to the output pins, be sure to connect a freewheel diode between OUT and GND.
Moisture-Proof Packing
After the pack is opened, use the devices in a 30C, 60% RH environment, and within 48 hours. Embossed-tape packing cannot be baked. Devices so packed must be within their allowable time limits after unpacking, as specified on the packing. Standard tape packing quantity: 2000 devices / reel (EL1)
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Package Dimensions
SSOP24-P-300-1.00C Unit: mm
Weight: 0.29g (typ.)
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RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
20070701-EN
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
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